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Why next-gen chips separate Data & Power

Published on Sat, Apr 6th 2024 Science & Technology Rectangular HD

Backside Power Delivery promises huge efficiency and performance advantages for modern computer chips, but also changes the semiconductor manufacturing process. Let's go an a deep-dive into Intel's PowerVia technology.

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0:00 Intro
0:55 Current semiconductor manufacturing
3:27 The problem with the frontside silicon & metal layers
7:35 Backside Power Delivery manufacturing
11:06 Advantages of BSPD / Intel PowerVia / Blue Sky Creek
14:24 Design-Technology Co-Optimization / cell area scaling
15:54 The Future of Semiconductor manufacturing