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AMD ZEN 6 — Next-gen Chiplets & Packaging

Ajouté le dim. 11 févr. 2024 Science et technologie Rectangular HD

AMD's Infinity Fabric On-Package has been used since Zen 2 in 2019, it's time for a change! In this video we will discuss next-gen interconnect and packaging rumored to be introduced with Zen 6, including silicon interposer, silicon bridge and organic RDL technologies.

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MLID Zen 6 leak video: https://www.youtube.com/watch?v=qpzTmKjaIMU

0:00 Intro
1:21 Infinity Fabric On-Package / Zen 2
3:22 Next-gen interconnects
3:46 Silicon Interposer Technology
6:12 Silicon Bridge Technology
9:22 Organic RDL Technology / AMD Infinity Links
13:11 Zen 6 Layout & Packaging
15:14 Conclusion